China Polyimide Base Material Semi Flex Pcb Thickness and Rigid Circuit Board
PCB parameter:
Brand:Oneseine
PCB Type: 2 layer flexible PCB
Line Width and Line Spacing :
0.16mm/0.11mm
Board Thickness :1.2+/-0.03mm
Surface Treatment :ENIG(Au
3uin, Ni 120uin)
Application:Medical equipment
Hole:High precision 0.05mm
Oneseine’s Service:
Support Custom 1-30 Layer FPC Flexible
PCB,2-32 Layer Rigid-Flex Circuit Boards,1-60 Layer Rigid PCB,HDI PCB,Reliable
Quick Turn PCB Prototyping,Fast Turn SMT PCB Assembly
Industry We Service:
Medical Device, IOT, TUT, UAV, Aviation,
Automotive, Telecommunications, Consumer Electronics, Military, Aerospace,
Industrial Control, Artificial Intelligence, EV, etc…
Rigid Flexible Circuit Board PCB
Fabrication Process:
1. Cutting: Cutting of hard board base
material: Cut a large area of copper-clad board into the size required by the
design.
2. Cutting the flexible board base
material: Cut the original roll material (base material, pure glue, covering
film, PI reinforcement, etc.) into the size required by the engineering design.
3. Drilling: Drill through holes for
circuit connections.
4. Black hole: Use potion to make the
toner adhere to the hole wall, which plays a good role in connection and
conduction.
5. Copper plating: Plate a layer of copper
in the hole to achieve conduction.
6. Alignment exposure: Align the film
(negative) under the corresponding hole position where the dry film has been
pasted to ensure that the film pattern can correctly overlap with the board surface.
The film pattern is transferred to the dry film on the board surface through
the principle of light imaging.
7. Development: Use potassium carbonate or
sodium carbonate to develop the dry film in the unexposed areas of the circuit
pattern, leaving the dry film pattern in the exposed area.
8. Etching: After the circuit pattern is
developed, the exposed area of the copper surface is etched away by the etching
solution, leaving the pattern covered by the dry film.
9. AOI: Automatic optical inspection. Through
the principle of optical reflection, the image is transmitted to the equipment
for processing, and compared with the set data, the open and short circuit
problems of the line are detected.
10. Lamination: Cover the copper foil
circuit with an upper protective film to prevent circuit oxidation or short
circuit, and at the same time function as insulation and product bending.
11. Laminating CV: Press the pre-laminated
covering film and reinforced plate into a whole through high temperature and
high pressure.
12. Punch: Use the mold and the power of
the mechanical punch to punch the work plate into the shipping size that meets
the customer's production requirements.
13. Lamination (superposition of
rigid-flex pcb boards)
14. Pressing: Under vacuum conditions, the
product is gradually heated, and the soft board and hard board are pressed
together through hot pressing.
15. Secondary drilling: Drill the via hole
connecting the soft board and the hard board.
16. Plasma cleaning: Use plasma to achieve
effects that conventional cleaning methods cannot achieve.
17. Immersed copper (hard board): A layer
of copper is plated in the hole to achieve conduction.
18. Copper plating (hard board): Use
electroplating to thicken the thickness of hole copper and surface copper.
19. Circuit (dry film): Paste a layer of
photosensitive material on the surface of the copper-plated plate to serve as a
film for pattern transfer. Etching AOI wiring: Etching away all the copper
surface except the circuit pattern, etching out the required pattern.
20. Solder mask (silk screen): Cover all
lines and copper surfaces to protect the lines and insulate.
21. Solder mask (exposure): The ink
undergoes photopolymerization, and the ink in the screen printing area remains
on the board surface and solidifies.
22. Laser uncovering: Use a laser cutting
machine to perform a specific degree of laser cutting on the position of the
rigid-flex junction lines, peel off theflexible board part, and expose the soft
board part.
23. Assembly: Paste steel sheets or
reinforcements on the corresponding areas of the board surface to bond and
increase the hardness of important parts of the FPC.
24. Test: Use probes to test whether there
are open/short circuit defects to ensure product functionality.
25. Characters: Print marking symbols on
the board to facilitate the assembly and identification of subsequent products.
26. Gong plate: Use CNC machine tools to
mill out the required shape according to customer requirements.
27. FQC: The finished products will be
fully inspected for appearance according to customer requirements, and
defective products will be picked out to ensure product quality.
28. Packaging: The boards that have passed
the full inspection will be packed according to customer requirements and
shipped to the warehouse
Oneseine Flexible PCB & Rigid-Flex PCB
Process Capability
|
Category |
Process Capability |
Category |
Process Capability |
|
Production Type |
Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB |
Layers Number |
1-30 layers FPC 2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB HDI Boards |
|
Max Manufacture Size |
Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm |
Insulating Layer Thickness |
27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um |
|
Board Thickness |
FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm |
Tolerance of PTH Size |
±0.075mm |
|
Surface Finish |
Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP |
Stiffener |
FR4 / PI / PET / SUS / PSA/Alu |
|
Semicircle Orifice Size |
Min 0.4mm |
Min Line Space/ width |
0.045mm/0.045mm |
|
Thickness Tolerance |
±0.03mm |
Impedance |
50Ω-120Ω |
|
Copper Foil Thickness |
9um/12um / 18um / 35um 70um/100um |
Impedance Controlled Tolerance |
±10% |
|
Tolerance of NPTH Size |
±0.05mm |
The Min Flush Width |
0.80mm |
|
Min Via Hole |
0.1mm |
Implement Standard |
GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Polyimide is a widely used flexible
substrate material for flex circuit prototyping and manufacturing, and it
offers several key advantages:
oneseine
1. Superior Flexibility and Durability:
- Polyimide has excellent
flexibility, allowing it to withstand repeated bending and flexing without
cracking or breaking.
- It has a high resistance to
fatigue, making polyimide-based flex circuits suitable for applications with
dynamic flexing requirements.
2. Thermal Stability:
- Polyimide has a high glass
transition temperature (Tg) and can operate at elevated temperatures, typically
up to 260°C.
- This thermal stability
makes polyimide suitable for applications with high-temperature environments or
processes, such as soldering.
3. Excellent Electrical Properties:
- Polyimide has a low
dielectric constant and dissipation factor, which helps maintain signal
integrity and minimizes crosstalk in high-frequency applications.
- It also exhibits high
insulation resistance and dielectric strength, enabling the use of fine-pitch
traces and high-density circuits.
4. Chemical and Environmental Resistance:
- Polyimide is highly
resistant to a wide range of chemicals, solvents, and environmental factors,
such as moisture and UV exposure.
- This resistance makes
polyimide-based flex circuits suitable for applications in harsh environments
or where they may be exposed to various chemicals.
5. Dimensional Stability:
- Polyimide has a low
coefficient of thermal expansion (CTE), which helps maintain dimensional
stability and minimize distortion during fabrication and assembly.
- This property is
particularly important for achieving high-precision, high-density circuits.
6. Availability and Customization:
- Polyimide-based flex
circuit materials are widely available from various suppliers, making them
accessible for prototyping and production.
- These materials can also be
customized in terms of thickness, copper foil weight, and other specifications
to meet specific design requirements.
The combination of superior mechanical,
thermal, electrical, and environmental properties makes polyimide an excellent
choice for flex circuit prototyping and production, particularly for
applications that require high reliability, flexibility, and performance.
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